Bullish
ASML's High-NA EUV technology adoption accelerates as major chipmakers commit
In the past 24 hours, ASML has seen significant developments in the semiconductor industry. Major chipmakers, including Samsung, TSMC, Intel, and SK hynix, have committed to integrating ASML's advanced High-NA EUV lithography technology into their production lines by 2028-2030. This adoption is driven by the growing demand for AI and server chips, which require more advanced manufacturing processes.
Key points
- Samsung plans to commence volume manufacturing with High-NA EUV by 2028, with TSMC following by 2030.
- Intel has processed over one million 300-mm wafers using High-NA EUV scanners, outpacing the rest of the industry combined.
- Chinese memory manufacturers CXMT and YMTC have secured a significant stockpile of DUV lithography machines from ASML, enough to support their next three years of expansion.
- ASML's Annual General Meeting approved a final dividend of €2.70 per share, bringing the total 2025 dividend to €7.50 per share.
Sources
- Big chipmakers are already committed to using ASML's next-generation production technology by as soon as 2028PC Gamer · September 8, 2026
- Intel surpasses one million High-NA EUV wafers processed, outpaces the rest of the industry combinedTom's Hardware · September 8, 2026
- Chinese memory makers have reportedly stocked up on enough western DUV machines for the next three years of expansionPC Gamer · September 8, 2026
- ASML AGM backs €7.50 2025 dividend, board movesStockTitan · April 22, 2026
AI-generated from public news sources. Not financial advice.
