Neutral
TSMC partners with ASML to develop 12-inch EUV photomasks for advanced chip production.
TSMC has announced a collaboration with ASML to lead the semiconductor industry's transition to larger 12-inch extreme ultraviolet (EUV) lithography photomasks for advanced chip production. The partnership aims to establish a pilot production line for 12-inch EUV photomasks by 2031 and prepare the lithography ecosystem for volume manufacturing by 2033. ([focustaiwan.tw](https://focustaiwan.tw/business/202609080020?utm_source=openai))
Key points
- TSMC and ASML's partnership to develop 12-inch EUV photomasks for advanced chip production.
- The collaboration aims to establish a pilot production line for 12-inch EUV photomasks by 2031 and prepare the lithography ecosystem for volume manufacturing by 2033.
Sources
AI-generated from public news sources. Not financial advice.
